6-layer immersion gold 5G application board

The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).

Category： 6-layer immersion gold 5G application board

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product description

The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).