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产品内容
4-layer immersion tin automotive board
The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).
隐藏域元素占位
6-layer immersion gold automotive board
The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).
隐藏域元素占位
6-layer immersion gold 5G application board
The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).
隐藏域元素占位
16-layer immersion gold communication board
The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).
隐藏域元素占位
8-layer immersion gold industrial control board
沉金工艺之目的的是在印制线路表面上沉积颜色稳定,光亮度好,镀层平整,可焊性良好的镍金镀层。基本可分为四个阶段:前处理(除油,微蚀,活化、后浸),沉镍,沉金,后处理(废金水洗,DI水洗,烘干)。
隐藏域元素占位
12 layers of immersion gold + gold finger security board
The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, smooth coating and good solderability on the surface of the printed circuit. It can be basically divided into four stages: pre-treatment (oil removal, micro-etching, activation, post-dipping), nickel immersion, gold immersion, post-treatment (waste gold washing, DI washing, drying).
隐藏域元素占位
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