产品中心

Production Technology

Serial Number Project Parameters
1 Surface treatment OSP, lead-free spray tin, immersion gold, immersion tin, immersion silver, gold finger, carbon oil, blue glue, etc.
2 Board Layers 2-16 layers
3 Minimum wire width 0.076mm
4 Minimum wire spacing 0.076mm
5 Minimum line-to-disk, disk-to-disk spacing 0.076mm
6 Minimum Drill Diameter 0.2mm
7 Minimum via pad diameter 0.45mm
8 Maximum drilling plate thickness ratio 1:6.4
9 Maximum finished size 500mm×650mm
10 Finished sheet thickness range 0.4mm -4.0mm
11 Minimum width of green bridge 0.08mm
12 Minimum unilateral opening of green oil (clearance) 0.05mm
13 Minimum Green Oil Thickness 0.4mil
14 Soldermask Photosensitive Solder Mask, Thermoset Solder Mask, UV Solder Mask
15 Minimum character line width 0.1mm
16 Minimum character height 0.7mm
17 Silkscreen Character Color white, yellow, black, green
18 Data File Format Gerber RS-274X, .PCB, etc.
19 Electrical Performance Test Open short circuit test, impedance test, special test, flying probe test, etc.
20 PCB processing of various types of boards as substrates CEM-3, FR-4 medium and high TG, high frequency and high speed (ROGERS/ARLON/TACONIC), halogen free, etc.
21 Additional testing requirements Immersion tin test, tensile test, impedance test, etc.
22 Special craftsmanship Spray Tin Gold Fingers (Blind Orifice), V-shaped Orifice
23 Substrate copper thickness H/HOZ, 1/1OZ, 2/2OZ, 3/3OZ, etc.